IEC TC 91 standardisarjat

Olosuhdetestit ja juotosliitosten ominaisuuksien testaus

IEC 60068-2-20Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-21 Robustness of terminations and integral mounting devices

IEC 60068-2-44 Guidance on test T: Soldering

IEC 60068-2-54 Solderability testing of electronic components by the wetting balance method

IEC 60068-2-58 Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 60068-2-69 Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

IEC 60068-2-77 Body strength and impact shock

IEC 60068-2-82 Whisker test methods for electronic and electric components

IEC/60068-3-12 Method to evaluate a possible lead-free solder reflow temperature profile

Piirilevyjen, komponenttien ja komponenttilevyjen merkinnät

IEC/PAS 62588 Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

IEC 62090 Product package labels for electronic components using bar code and two-dimensional symbologies

Pintaliitostekniikka ja ominaisuuksien testaus

IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
 
IEC 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 62137 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
 
IEC 62137-1-1 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

IEC 62137-1-2 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Juoteseokset, pastat ja juoksutteet

IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
 
IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
 
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Komponenttilevyjen kokoonpano ja laadun valvonta
 
IEC 61191-1 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
 
IEC 61191-2 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
 
IEC 61191-3 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
 
IEC 61191-4 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
 
IEC 61192-1 Workmanship requirements for soldered electronic assemblies - Part 1: General
 
IEC 61192-2 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
 
IEC 61192-3 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
 
IEC 61192-4 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

IEC 61192-5 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
 
IEC 61193-1 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
 
IEC 61193-2 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Piirilevyt
 
IEC 62326-1 Printed boards - Part 1: Generic specification

IEC 62326-4 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

IEC 62326-4-1 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

IEC/PAS 61249-3-1 Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
 
IEC/PAS 62326-7-1 Performance guide for single- and double-sided flexible printed wiring boards

IEC 60097

Grid systems for printed circuits

IEC 60194 Printed board design, manufacture and assembly - Terms and definitions

Piirilevyjen ja komponenttilevyjen suunnittelu ja käyttö
 
IEC 61188-1-1 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

IEC 61188-1-2 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
 
IEC 61188-5-1 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
 
IEC 61188-5-2 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
 
IEC 61188-5-3 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
 
IEC 61188-5-4 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
 
IEC 61188-5-5 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
 
IEC 61188-5-6 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
 
IEC 61188-5-8 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Testimenetelmät materiaaleille ja liitosrakenteille

IEC 61189-1 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
 
IEC 61189-2 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
 
IEC 61189-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
 
IEC 61189-5 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
 
IEC 61189-6 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Piirilevymateriaalit

IEC 61249-sarja